Dispensing Solutions
Versatile High Speed Dispensing Systems
Equipped with the most modern, accurate systems that drive and steering technology offers today. Mediums rarely behave the same way, environmental conditions are significant for the behavior of liquid changes. This is why there is virtually no standard application in dispensing. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.
Tarantula – High Speed Dispenser
- Up to 3 dispense valves simultaneously
- 5 different valves, large application range
- Up to 145’000 dots/h (with Piezo Jet Valve)
- Up to 2’000’000 dot/h line mode
- PCB size 560 x 610 mm, optional 1’800 x 610 mm
- Up to 80 mm (3.35”) programmable Z stroke
- No vibration, symmetrical mineral casting
- No warpage, no thermal drift
Spider – Smart-Sized High Speed Dispenser
- Up to 2 dispense valves simultaneously
- 5 different valves, large application range
- Up to 150’000 dots/h (with Piezo Jet Valve)
- Up to 2’000’000 dot/h line mode
- Small foot print - Requires only 1 m² of production floor
- Machine fits through 90 cm wide door
Archer Fish - Solder Paste Jet Printing
- Placement, solder paste & other jet dispensing
- One space saving platform for all processes
- Adaptable for different jettable pastes & other media
- Adaptable for special application
- Upto 4 placement axis and 3 dispense processes
- Optimum speed upto 80,000 dph
SOLDER PASTE JET PRINTING, GLUE JETTING AND PICK & PLACE ON A SINGLE PLATFORM
Combined All-in-one & EXPANSION IN ANY DIRECTION
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