3D Solder Paste Inspection

Viscom’s compact SPI system inspects solder paste application in SMD production with maximum speed and precision. 3D features, such as volume, height, and shape as well as surface area, displacement, and smearing are accurately recorded. The 3D inline system demonstrates our decades of experience in reliable, high throughput solder paste inspection systems.
Highlights :
- 100% defect identification for ultimate reliability
- Cutting-edge 3D camera technology
- Improved inspection speed
- Module change in up to 2.5 seconds
- End-to-end process analysis with Viscom Quality Uplink
- Closed loop enhances quality and efficiency
- Transport height: 950 mm / ±50
Specifications :
- Z Resolution : 0.1 μm
- Resolution of Orthogonal Camera : 10μm
- Field of View : 58.2 x 58.2 mm
- Inspection Speed : 90 cm²/sec
- PCB Size : 508 x 508 mm

Contact us for Industrial Electronics Manufacturing & Testing Solutions