Viscom’s compact SPI system inspects solder paste application in SMD production with maximum speed and precision. 3D features, such as volume, height, and shape as well as surface area, displacement, and smearing are accurately recorded. The 3D inline system demonstrates our decades of experience in reliable, high throughput solder paste inspection systems.
Highlights :
100% defect identification for ultimate reliability
Cutting-edge 3D camera technology
Improved inspection speed
Module change in up to 2.5 seconds
End-to-end process analysis with Viscom Quality Uplink
Closed loop enhances quality and efficiency
Transport height: 950 mm / ±50
Specifications :
Z Resolution : 0.1 μm
Resolution of Orthogonal Camera : 10μm
Field of View : 58.2 x 58.2 mm
Inspection Speed : 90 cm²/sec
PCB Size : 508 x 508 mm
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