Viscom 3D Wirebond Inspection
The 3D bond inspection systems from Viscom are ushering in a technological shift. Designed specifically to meet the challenges of wire bonding, the new and innovative 3D bond system from Viscom detects bond wires of up to 20 μm.
The 3D wire bond inspection system was developed for all standard bond procedures, including ball wedge, wedge wedge, and security bonds; different materials and alloys of aluminum, copper, silver, gold, and other metals whether as ribbons, thick wire, or thin wire. The inspection includes the bond positions, wire paths, and component positions.
S6056BO and S6053BO-V: Reliable 2D and 3D Wire Bond Inspection :
- Future-looking 3D technology
- Long-term investment security
- Highly flexible configuring capability, even with project-specific requirements
- Excellent image quality thanks to high resolution and sophisticated lighting
- Ideal for demanding inspection tasks
X7065-II BO – Quick, Precise Inspection for Bonding Wires :
- Combined bond AOI and bond AXI
- Maximum inspection depth
- Versatile camera module selection for thick and thin wires
- High-throughput wire bond inspection
- Maintenance-free sealed microfocus X-ray tube
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